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Semiconductor
Solutions
The Semiconductor Solutions division offers and supports several key products for the quick-changing semiconductor marketplace. BKM sells cost – effective refurbished and reconfigured Semiconductor Backend Inspection equipment including package inspection and die sorting tools. Parts, repairs and calibration of installed tools are also provided at very low cost.
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- RVSI Inspection Lead Scanning
BKM Technology Partners has purchased the RVSI Inspection lead scanner (LS) assets from Rudolph Technologies, Inc. BKM Technology Partners now provides worldwide sales, service and support for RVSI LS products. Services include:
- RVSI LS Support: BKM Technology Partners provides custom support plans for RVSI LS tools. Using dedicated staff as well as a worldwide network of RVSI - experienced representatives and distributors, coverage is available throughout the Americas, Asia and Europe. BKM has in-house labs to repair sensors as well as critical PCBs and other components. Our trained service and support team comprises BKM employees and Technology Partners personnel with extensive industry experience, including
- Certified Technicians (10+ years supporting semiconductor equipment)
- Degreed Engineers (10+ years supporting semiconductor equipment)
- Extensive RVSI LS Experience (5+ years supporting RVSI LS equipment
- RVSI LS Spare Parts: An extensive supply of RVSI LS spare parts in depots in North American and the Asia-Pacific ensures timely spares availability. BKM Technology Partners offers individualized spare parts inventory plans that determine which components should be inventoried, to what levels, and at what locations to minimize inventories and maximize availability.
- RVSI LS Upgrades: The following field upgrades are available for RVSI LS tools:
- Lead-free inspection
- High-speed Tape & Reel (TNR)
- High-speed Pick & Place (PNP)
- Tray inverting modules
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Hercules Die Sorter
- BKM Technology Partners introduces a new evolution of WLP handling systems, the Hercules Die Sorter. Designed for die sizes from 1.0 x 1.0 mm to 10 x 10 mm both in standard and thin thicknesses, the Hercules can handle Bumped Die, Bare Die or Leadless Packages. The integrated state-of-the-art vision allows complete inspection of die, including 3-D. Key features include:
- 2-Touch Pick & Place Concept with Soft Touch™ control
- Flip and Non-Flip Capabilities
- Bump and PVI Vision Inspection Capabilities (2D/3D)
- Back-side PVI Inspection Capabilities
- 4-edge PVI Vision Inspection Capabilities
- High Throughput at 12,000 – 15,000 UPH (feature dependent)
- Quick Load / Unload Ring Mechanism Change
- Input Pick-up Mechanism has Precision Voice Coil Sensing
- Flexible Modular Design
- Small Footprint
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© BKM Technology Partners 2009
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